{"id":97,"date":"2022-01-19T15:23:25","date_gmt":"2022-01-19T06:23:25","guid":{"rendered":"https:\/\/nanoimprint.jp\/nnt2026\/?page_id=97"},"modified":"2022-09-28T11:37:16","modified_gmt":"2022-09-28T02:37:16","slug":"plenary-invited","status":"publish","type":"page","link":"https:\/\/nanoimprint.jp\/nnt2026\/plenary-invited\/","title":{"rendered":"Plenary\/Invited"},"content":{"rendered":"

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NNT 2026 Plenary Speakers List<\/font><\/td>\n<\/tr>\n
Prof. Stephen Y. Chou, Princeton University, USA
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Prof. Lars Montelius, Lund University. Sweden
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\n<\/Font><\/strong>Science in our times - for People, Planet and Prosperity
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\nProf Lars Montelius, Lund University, Sweden. His +35 years of work have centered around development of Nanotechnology and Advanced Materials. He has published about 250 articles, presented 100\u00b4s of invited talks and has filed about 40 patents. During 2014-2022 he was the Director\u2013General of the International Iberian Nanotechnology Laboratory, headquartered in Portugal. He is Board Director of the IAM-I association and an Advisor to several European HEIs and RTOs. He is the founder & funder & advisor of several Swedish deep-tech companies such as: Obducat AB, Cellevate AB, WaterSprint AB, Compacta AB, Embedded Nano AB.
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Mr. Keita Sakai, Canon Inc., Japan
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\n<\/Font><\/strong>Enabling Advanced Semiconductor Manufacturing with Nanoimprint Lithography and Inkjet-Based Adaptive Planarization<\/td>\n<\/tr>\n
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\nMr. Keita Sakai is the Senior General Manager of the Semiconductor Production Equipment PLM Center 3 at Canon Inc. Since 2015, he has been engaged in the development of Nanoimprint Lithography in this organization. Prior to this role, he was part of the R&D Headquarters of Canon Inc. He has focused his career on next-generation lithography, including F2 lithography, ArF immersion lithography, and nanoimprint lithography. He received an M.S. degree in Materials Science from Keio University, Japan.<\/td>\n<\/tr>\n
NNT 2026 Invited Speakers List<\/font><\/td>\n<\/tr>\n
Prof. Stella W. Pang, City University of Hong Kong
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Prof. James J. Watkins, University of Massachusets Amherst, USA
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Prof. Jun Mizuno, National Cheng Kung University, Taiwan<\/strong>
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\n<\/Font>Recent Trends in Heterogeneous Integration
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\nReceived a Ph.D. in Received a Ph.D. in Engineering from Tohoku University Currently a professor at the Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University Focusing on heterogeneous integration in semiconductor technology (Thermal management, Hybrid bonding, Low-temperature bonding between compound semiconductor substrate materials, Glass and SiC interposers, Antenna-in-Package and Wafer cleaning), I am conducting joint research in collaboration with Taiwanese foundry manufacturers (TSMC etc.), OSAT manufacturers (ASE, etc.), and Japanese materials and equipment manufacturers.<\/td>\n<\/tr>\n
Dr. Takuo Tanaka, RIKEN, Japan
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\nTakuo Tanaka is a team director of RIKEN. He received his PhD degree in 1996 from Osaka University. After that, he joined faculty of Engineering Science, Osaka University as an assistant professor. In 2003, he moved to RIKEN as a research scientist in Nanophotonics Laboratory. He was promoted to associate chief scientist in 2008 and to chief scientist in 2017. From 2025, he became Team director of RIKEN Center for Advanced Photonics. His research background is three-dimensional microscopy such as confocal microscope. Recently, he is studying about nanophotonics, plasmonics, and metamaterials fields with developing many new nanofabrication techniques.
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Prof. Heon Lee, Korea University, Korea
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\n<\/Font><\/strong>Mass production technology for metalens using nanoimprint<\/td>\n<\/tr>\n
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\nAfter receiving his Ph.D. from Stanford University in 1996, Professor Heon Lee worked as a researcher at Bell Labs, Siemens Microelectronics, and HP Labs, and has been a professor in the Department of Materials Science and Engineering at Korea University since 2004. His main research areas are the development of metalens fabrication technology using nanoimprinting and the development of radiative cooling technology utilizing metamaterials. He is the author of 400 sci papers, with 13,329 citations and an H-index of 58.
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Dr. Ran Ji, GermanLith, Germany
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Dr. J\u00e9r\u00f4me RECHE, CEA-Leti, France
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\n<\/Font><\/strong>Soft-UV NIL at wafer scale: A story of distortion<\/td>\n<\/tr>\n
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\nDr. J\u00e9r\u00f4me RECHE earned his doctorate in 2019, specializing in metrology data fusion. He advanced soft nanoimprint lithography at wafer-scale, he led research for its integration as a standard and its promotion for 3D applications. Since 2024, he has been part of CEA-LETI's expert group. He is also a coordinator of the R\u00e9NIL group, a leading NIL group in France, promoting nanoimprint lithography and its industrialization. He is currently pushing for a more sustainable microelectronics industry, focusing on fluor-free lithography materials and sustainable processes like NIL.
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Dr. Arne Schleunitz, micro resist technology GmbH, Germany
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Dr. Helmut Schift, Paul Scherrer Institut, Switzerland
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