Plenary / Invited
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Recent Trends in Heterogeneous Integration
Received a Ph.D. in Received a Ph.D. in Engineering from Tohoku University Currently a professor at the Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University Focusing on heterogeneous integration in semiconductor technology (Thermal management, Hybrid bonding, Low-temperature bonding between compound semiconductor substrate materials, Glass and SiC interposers, Antenna-in-Package and Wafer cleaning), I am conducting joint research in collaboration with Taiwanese foundry manufacturers (TSMC etc.), OSAT manufacturers (ASE, etc.), and Japanese materials and equipment manufacturers.
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